The application of epoxy resin for heat insulation board, pay attention to the development and modification technology of epoxy resin and curing agent, promote the coordinated development of epoxy resin industry, and solve the situation of advanced production capacity and insufficient demand in domestic epoxy resin industry. From the application field of epoxy resin, six major development directions of curing agent are listed.

One is functional curing agent: Compared with traditional heat insulation board curing agent, functional curing agent usually has excellent properties such as rapid curing, low temperature curing, toughening, and flame retardant.

The second is low-toxicity and non-toxic curing agent. At present, the industry not only pays attention to the problem of toxicity and environmental pollution during the production and use of heat insulation board curing agent, but also pays attention to the long-term pollution of waste epoxy resin products.

The third is a curing agent that can adapt to the special environment of the thermal insulation board. For example, a curing agent that maintains good and stable performance in harsh environments such as humidity, underwater, and outdoor.

Fourth, the curing agent with excellent electrical conductivity, mechanical properties and mechanical properties of the thermal insulation board will be greatly developed.

Fifth, the electron beam and light-curing products of heat insulation panels have attracted more and more attention.

Sixth, how to use heat insulation board powder coatings, special curing agents for water-based epoxy resin coatings and single-component adhesive curing agents have broad prospects.

Mold insulation board, high temperature resistant board, non-deformation equipment insulation board, etc. are all new energy-saving materials made of other composite materials by thermocompression in view of the function of resin curing agent.

For the development direction of ultra-high temperature thermal insulation panels, specific modification technologies matching it are proposed, such as: aliphatic amine modification, epoxy resin aromatic amine modification, acid compound modification and liquefaction, dicyandiamide modification And liquefaction, imidazole modification and liquefaction, etc. Under the premise of complying with environmental protection and safety regulations and meeting the needs of users, it is the long-term task of heat insulation board curing agent manufacturers to continuously reduce costs and develop towards serialization, specialization, matching and refinement. In order to accelerate the coordinated and healthy development of the insulation board resin industry, epoxy resin and curing agent manufacturers should form partnerships and promote each other, which is an effective way for the entire industry to succeed.